Radio frequency module including segmented conductive top layer

ABSTRACT

A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation.

RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/039,791, Filed Sep. 27, 2013, entitled SEGMENTED CONDUCTIVE TOP LAYERFOR RADIO FREQUENCY ISOLATION, which claims priority to: U.S.Provisional Application No. 61/707,673 filed Sep. 28, 2012, entitledSYSTEMS AND METHODS FOR PROVIDING INTRAMODULE RADIO FREQUENCY ISOLATION;U.S. Provisional Application No. 61/707,622 filed Sep. 28, 2012,entitled SEGMENTED CONDUCTIVE TOP LAYER FOR RADIO FREQUENCY ISOLATION;and U.S. Provisional Application No. 61/707,578 filed Sep. 28, 2012,entitled SEGMENTED CONDUCTIVE GROUND PLANE FOR RADIO FREQUENCYISOLATION, the disclosures of which are hereby expressly incorporated byreference in their entirety.

BACKGROUND

1. Field

The present disclosure generally relates to the field of electronics,and more particularly, to devices and methods providing radio frequency(RF) isolation for electronic devices such as overmolded semiconductorpackages.

2. Description of Related Art

Radio frequency (RF) is a common term for a range of frequency ofelectromagnetic radiation typically used to produce and detect radiowaves. Such a range can be from about 30 kHz to 300 GHz. In somesituations, operation of an electronic device can be adversely affectedby undesired RF signals.

To address such problems, RF isolating structures and/or methods canprovide reduced effects of undesired RF signals. Such RF shieldingtypically operates based on what is commonly referred to as the Faradaycage principle.

SUMMARY

Some embodiments disclosed herein provide an apparatus including asubstrate, a first radio frequency device mounted on a surface of thesubstrate and a second radio frequency device mounted on the surface ofthe substrate. The apparatus may further include a first conductiveground layer disposed at least partially below the first radio frequencydevice, a first plurality of wirebond structures disposed on thesubstrate between the first radio frequency device and the second radiofrequency device, and a molding dimensioned to encapsulate the first andsecond radio frequency devices and at least a portion of the wirebondstructures. The apparatus may further include a first conductive toplayer at least partially disposed above the radio frequency device, thefirst conductive top layer in electrical contact with one or more of thefirst plurality of wirebond structures such that the first conductiveground layer, the one or more of the first plurality of wirebondstructures, and the first conductive top layer at least partially form aradio frequency barrier between the first radio frequency device and thesecond radio frequency device.

In certain embodiments, at least some of the first plurality of wirebondstructures may form a first row between the first and second radiofrequency devices. Furthermore, at least some of the first plurality ofwirebond structures may form a second row, substantially parallel to thefirst row.

The apparatus can further include a third radio frequency device mountedon the substrate. The first and second radio frequency devices may beeach electrically connected to the third radio frequency device.Furthermore, the first radio frequency device may include a firstswitching device, the second radio frequency device may include a secondswitching device, and the third radio frequency device may include anamplifier device. In certain embodiments, the apparatus includes asecond plurality of wirebond structures disposed on the surface of thesubstrate between the first radio frequency device and the third radiofrequency device, at least partially forming a radio frequency barrierbetween the first and third radio frequency devices. Furthermore, athird plurality of wirebond structures may be disposed on the surface ofthe substrate between the second radio frequency device and the thirdradio frequency device, at least partially forming a radio frequencybarrier between the second and third radio frequency devices. In certainembodiments, at least some of the first plurality of wirebond structurescan form a first row between the first and second radio frequencydevices, and at least some of the second plurality of wirebondstructures can form a second row between the first and third radiofrequency devices, the second row being disposed at a substantiallyright angle with respect to the first row.

In some embodiments, a method of providing RF shielding for a pluralityof devices can include providing a substrate; positioning a plurality ofradio frequency devices on the substrate; disposing a first plurality ofwirebond structures on the substrate between first and second devices ofthe plurality of radio frequency devices; and connecting the firstplurality of wirebond structures between a conductive top layer and aconductive ground layer. The first plurality of wirebond structures, atleast a portion of the conductive top layer, and at least a portion ofthe conductive ground layer may at least partially form a radiofrequency barrier between the first device and the second device.

In certain embodiments, disposing a first plurality of wirebondstructures on the substrate includes forming a first row of wirebondstructures between the first and second devices. Disposing a firstplurality of wirebond structures on the substrate may further includeforming a second row of wirebond structures between the first and seconddevices, the second row being substantially parallel to the first row.

The plurality of radio frequency devices may include a third device. Themethod providing RF shielding may further include electricallyconnecting the first and second devices to the third device. In someembodiments, the first device includes a first switching device, thesecond device includes a second switching device, and the third deviceincludes an amplifier device. The method may further include disposing asecond plurality of wirebond structures on the substrate between thefirst device and the third device, the second plurality of wirebondstructures at least partially forming a radio frequency barrier betweenthe first and third devices. In addition, the method may includedisposing a third plurality of wirebond structures on the substratebetween the second device and the third device, the third plurality ofwirebond structures at least partially forming a radio frequency barrierbetween the second and third radio frequency devices.

At least some of the first plurality of wirebond structures may form afirst row between the first and second devices, and at least some of thesecond plurality of wirebond structures may form a second row betweenthe first and third devices, the second row being disposed at asubstantially right angle with respect to the first row.

Certain embodiments provide a wireless device including a first antenna,a second antenna, and a radio frequency (RF) module including a firstswitching device electrically coupled to the first antenna and a secondswitching device electrically coupled to the second antenna. Thewireless device may further include a conductive top layer disposed atleast partially above the first switching device, a conductive groundlayer disposed at least partially below the first switching device, anda plurality of wirebond structures disposed between the first and secondswitching devices and connected to the conductive top layer andconductive ground layer, the plurality of wirebond structures at leastpartially forming a radio frequency barrier between the first and secondswitching devices. In certain embodiments, the RF module includes anamplifier device electrically connected to the first and secondswitching devices.

Certain embodiments provide an apparatus that includes a substrate, afirst radio frequency device mounted on a surface of the substrate, anda second radio frequency device mounted on the surface of the substrate.The apparatus may further include a first conductive ground layerdisposed at least partially below the first radio frequency device, afirst plurality of wirebond structures disposed on the substrate betweenthe first radio frequency device and the second radio frequency device,and a first conductive top layer disposed above the substrate and inelectrical contact with one or more of the first plurality of wirebondstructures such that the first conductive ground layer, the one or moreof the first plurality of wirebond structures, and the first conductivetop layer form a radio frequency barrier between the first radiofrequency device and the second radio frequency device. The apparatusmay further include a second conductive top layer disposed above thesubstrate, and a molding dimensioned to encapsulate the first and secondradio frequency devices and at least a portion of each of the wirebondstructures, wherein at least a portion of the first conductive top layeris disposed above the first radio frequency device and at least aportion of the second conductive top layer is disposed above the secondradio frequency device, the first and second conductive top layers beingat least partially electrically isolated from one another.

In certain embodiments, the first and second conductive top layers liein a first plane at or substantially near a top surface of the molding.The first plane may be substantially parallel to a surface of thesubstrate. In addition, the first and second conductive top layers maybe separated by at least one physical gap that spans a first portion ofthe first plane, the gap providing at least partial electrical isolationbetween the first and first conductive top layers.

The apparatus may include a third conductive top layer disposed abovethe substrate, wherein the third conductive top layer lies in the firstplane and is at least partially electrically isolated from both thefirst and second conductive top layers. The third conductive top layermay be disposed at least partially above a third radio frequency devicedisposed on the substrate.

An apparatus in accordance with embodiments disclosed herein may furtherinclude a second conductive ground layer disposed at least partiallybelow the second radio frequency device, the second conductive groundlayer being at least partially electrically isolated from the firstconductive ground layer. For example, the first conductive top layer maybe substantially the same shape as, and disposed above, the firstconductive ground layer, and the second conductive top layer issubstantially the same shape as, and disposed above, the secondconductive ground layer.

In certain embodiments, at least some of the first plurality of wirebondstructures forms a first row between the first and second radiofrequency devices. Furthermore, at least some of the first plurality ofwirebond structures may form a second row, substantially parallel to thefirst row.

In certain embodiments, the first radio frequency device includes afirst switching device, the second radio frequency device includes asecond switching device, and the third radio frequency device includesan amplifier device.

In some embodiments, a method of providing RF shielding for a pluralityof devices includes providing a substrate; positioning a plurality ofradio frequency devices on the substrate; disposing a first plurality ofwirebond structures on the substrate between first and second devices ofthe plurality of radio frequency devices; forming a first conductiveground layer; electrically connecting the first plurality of wirebondstructures to the first conductive ground layer; forming a moldingdimensioned to encapsulate the first and second devices and at least aportion of each of the first plurality of wirebond structures; forming afirst conductive top layer, at least partially above the first device,on a first portion of a top surface of the molding, the first conductivetop layer electrically contacting the first plurality of wirebondstructures such that the first conductive ground layer, the firstplurality of wirebond structures, and the first conductive top layer atleast partially form a radio frequency barrier between the first deviceand the second device; and forming a second conductive top layer, atleast partially above the second device, on a second portion of the topsurface of the molding. The first and second conductive top layers maybe at least partially electrically isolated from one another.

In certain embodiments, the first and second conductive top layers liein a first plane at or substantially near the top surface of themolding. The first plane is substantially parallel to the surface of thesubstrate.

In some embodiments, forming the first and second conductive top layerscomprises creating a physical gap between at least two portions of asingle conductive layer. The method may also include forming a thirdconductive top layer on a third portion of the top surface of themolding in the first plane, wherein the third conductive top layer is atleast partially electrically isolated from both the second and secondconductive top layers. The plurality of radio frequency devices mayinclude a third device, the third conductive top layer being disposed atleast partially above the third device. The method of claim 31 furthercomprising forming a second conductive ground layer, the secondconductive ground layer being at least partially electrically isolatedfrom the first conductive ground layer. The first conductive top layermay be substantially the same shape as, and disposed above, the firstconductive ground layer, and the second conductive top layer issubstantially the same shape as, and disposed above, the secondconductive ground layer.

Some embodiments provide an apparatus that includes a substrate, a firstradio frequency device mounted on the substrate, and a second radiofrequency device mounted on the substrate. The apparatus may furtherinclude a first conductive ground layer disposed below the surface ofthe substrate, a first plurality of wirebond structures disposed on thesurface of the substrate between the first radio frequency device andthe second radio frequency device, and a first conductive top layerdisposed above the substrate and in electrical contact with the firstplurality of wirebond structures such that the first conductive groundlayer, the first plurality of wirebond structures, and the firstconductive top layer at least partially form a radio frequency barrierbetween the first radio frequency device and the second radio frequencydevice. The apparatus may further include a molding dimensioned toencapsulate the first and second radio frequency devices and at least aportion of the first plurality of wirebond structures, wherein at leasta portion of the first conductive top layer is disposed above the firstradio frequency device and wherein no conductive top layer is disposedabove any portion of the second radio frequency device.

Some embodiments provide an apparatus that includes a substrate, a firstradio frequency device mounted on the substrate, and a second radiofrequency device mounted on the substrate. The apparatus may furtherinclude a first plurality of wirebond structures disposed on thesubstrate between the first radio frequency device and the second radiofrequency device, a first conductive ground layer disposed at leastpartially below the first radio frequency device and in electricalcontact with one or more of the first plurality of wirebond structures,and a second conductive ground layer disposed at least partially belowthe second radio frequency device, the second conductive ground layerbeing at least partially electrically isolated from the first conductiveground layer. The apparatus may further include a molding dimensioned toencapsulate the first and second radio frequency devices and at least aportion of the first plurality of wirebond structures and a firstconductive top layer disposed above a top surface of the molding and inelectrical contact with one or more of the first plurality of wirebondstructures; wherein the first conductive top layer, the first pluralityof wirebond structures, and the first conductive ground layer at leastpartially form a radio frequency barrier between the first radiofrequency device and the second radio frequency device. At least aportion of the first conductive ground layer may disposed below thefirst radio frequency device and at least a portion of the secondconductive ground layer may be disposed below the second radio frequencydevice.

The first and second conductive ground layers may lie in a first planeat or substantially near the surface of the substrate. Furthermore, thefirst plane may be substantially parallel to the surface of thesubstrate and/or the first and second conductive ground layers may beseparated by at least one physical gap that spans a first portion of thefirst plane, the gap providing at least partial electrical isolationbetween the first and second conductive ground layers.

In certain embodiments, the apparatus includes a third conductive groundlayer, wherein the third conductive ground layer lies in the first planeand is at least partially electrically isolated from both the first andsecond conductive ground layers. The third conductive top layer may bedisposed at least partially below a third radio frequency devicedisposed on the substrate.

In certain embodiments, the apparatus includes a second conductive toplayer disposed the top surface of the molding, the second conductive toplayer being at least partially electrically isolated from the firstconductive top layer. The first conductive top layer may besubstantially the same shape as, and disposed above, the firstconductive ground layer, and the second conductive top layer may besubstantially the same shape as, and disposed above, the secondconductive ground layer.

In certain embodiments, at least some of the first plurality of wirebondstructures forms a first row between the first and second radiofrequency devices. At least some of the first plurality of wirebondstructures may form a second row, substantially parallel to the firstrow. In some embodiments, the first radio frequency device includes afirst switching device, the second radio frequency device includes asecond switching device, and the third radio frequency device includesan amplifier device.

In some embodiments, a method of providing RF shielding for a pluralityof devices includes providing a substrate; positioning a plurality ofradio frequency devices on the substrate; disposing a first plurality ofwirebond structures on the substrate between first and second devices ofthe plurality of radio frequency devices; forming a first conductiveground layer; electrically connecting the first plurality of wirebondstructures to the first conductive ground layer; forming a secondconductive ground layer; forming a molding dimensioned to encapsulatethe first and second devices and at least a portion of the firstplurality of wirebond structures; and forming a first conductive toplayer, at least partially above the first device, on a first portion ofa top surface of the molding, the first conductive layer electricallycontacting the first plurality of wirebond structures such that thefirst conductive ground layer, the first plurality of wirebondstructures, and the first conductive top layer at least partially form aradio frequency barrier between the first device and the second device.The first and second conductive ground layers are at least partiallyelectrically isolated from one another.

In certain embodiments, the first and second conductive ground layerslie in a first plane at or substantially near a surface of thesubstrate. The first plane may be substantially parallel to the surfaceof the substrate. The first and second conductive ground layers may beseparated by at least one physical gap that spans a first portion of thefirst plane, the gap providing at least partial electrical isolationbetween the first and second conductive ground layers.

In certain embodiments, the method further includes forming a thirdconductive ground layer and positioning the third conductive groundlayer in the first plane, wherein the third conductive ground layer isat least partially electrically isolated from both the first and secondconductive ground layers. The plurality of radio frequency devices mayinclude a third device, the third conductive ground layer being disposedat least partially below the third device.

In certain embodiments, the method further includes forming a secondconductive top layer on a second portion of the top surface of themolding, the second conductive top layer being at least partiallyelectrically isolated from the first conductive top layer. The firstconductive top layer may be substantially the same shape as, anddisposed above, the first conductive ground layer, and the secondconductive top layer is substantially the same shape as, and disposedabove, the second conductive ground layer.

Certain embodiments disclosed herein provide a wireless device includinga first antenna, a second antenna and a radio frequency (RF) moduleincluding a first switching device electrically coupled to the firstantenna and a second switching device electrically coupled to the secondantenna. The wireless device may further include a plurality of wirebondstructures disposed between the first and second switching devices, afirst conductive ground layer disposed at least partially below thefirst switching device and in electrical contact with the plurality ofwirebond structures, and a second conductive ground layer disposed atleast partially below the second switching device, the second conductiveground layer being at least partially electrically isolated from thefirst conductive ground layer. In certain embodiments, the wirelessdevice further includes a first conductive top layer disposed at leastpartially above the first switching device and in electrical contactwith the plurality of wirebond structures; the first conductive toplayer, the plurality of wirebond structures, and the first conductiveground layer may at least partially form a radio frequency barrierbetween the first switching device and the second switching device.

In certain embodiments, the RF module includes an amplifier deviceelectrically connected to the first and second switching devices. Thewireless device may further include a third conductive ground layerdisposed at least partially below the amplifier device, the thirdconductive ground layer being at least partially electrically isolatedfrom the first and second conductive ground layers.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

The present disclosure relates to U.S. patent application Ser. No.14/039,790, entitled SYSTEMS AND METHODS FOR PROVIDING INTRAMODULE RADIOFREQUENCY ISOLATION, and U.S. Pat. No. 14/039,793, entitled SEGMENTEDCONDUCTIVE GROUND PLANE FOR RADIO FREQUENCY ISOLATION, each of which isfiled on even date herewith and hereby incorporated by reference hereinin its entirety.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments are depicted in the accompanying drawings forillustrative purposes, and should in no way be interpreted as limitingthe scope of the inventions. In addition, various features of differentdisclosed embodiments can be combined to form additional embodiments,which are part of this disclosure. Throughout the drawings, referencenumbers may be reused to indicate correspondence between referenceelements.

FIG. 1 shows a process that can be implemented to fabricate a packagedmodule that includes a die having an integrated circuit (IC).

FIGS. 2A1 and 2A2 show front and back sides of an example laminate panelconfigured to receive a plurality of dies for formation of packagedmodules.

FIGS. 2B1 to 2B3 show various views of a laminate substrate of the panelconfigured to yield an individual module.

FIG. 2C shows an example of a fabricated semiconductor wafer having aplurality of dies that can be singulated for mounting on the laminatesubstrate.

FIG. 2D depicts an individual die showing example electrical contactpads for facilitating connectivity when mounted on the laminatesubstrate.

FIGS. 2E1 and 2E2 show various views of the laminate substrate beingprepared for mounting of example surface-mount technology (SMT) devices.

FIGS. 2F1 and 2F2 show various views of the example SMT devices mountedon the laminate substrate.

FIGS. 2G1 and 2G2 show various views of the laminate substrate beingprepared for mounting of an example die.

FIGS. 2H1 and 2H2 show various views of the example die mounted on thelaminate substrate.

FIGS. 2I1 and 2I2 show various views of the die electrically connectedto the laminate substrate by example wirebonds.

FIGS. 2J1 and 2J2 show various views of wirebonds formed on the laminatesubstrate and configured to facilitate electromagnetic (EM) isolationbetween an area defined by the wirebonds and areas outside of thewirebonds.

FIG. 2K shows a side view of molding configuration for introducingmolding compound to a region above the laminate substrate.

FIG. 2L shows a side view of an overmold formed via the moldingconfiguration of FIG. 2K.

FIG. 2M shows the front side of a panel with the overmold.

FIG. 2N shows a side view of how an upper portion of the overmold can beremoved to expose upper portions of the EM isolation wirebonds.

FIG. 2O shows a portion of a panel where a portion of the overmold hasits upper portion removed to better expose the upper portions of the EMisolation wirebonds.

FIG. 2P shows a side view of a conductive layer formed over the overmoldsuch that the conductive layer is in electrical contact with the exposedupper portions of the EM isolation wirebonds.

FIG. 2Q shows a panel where the conductive layer can be a spray-onmetallic paint.

FIG. 2R shows individual packaged modules being cut from the panel.

FIGS. 2S1 to 2S3 show various views of an individual packaged module.

FIG. 2T shows that one or more of modules that are mounted on a circuitboard such as a wireless phone board can include one or more features asdescribed herein.

FIG. 3A shows a process that can be implemented to install a packagedmodule having one or more features as described herein on the circuitboard of FIG. 2T.

FIG. 3B schematically depicts the circuit board with the packaged moduleinstalled thereon.

FIG. 3C schematically depicts a wireless device having the circuit boardwith the packaged module installed thereon.

FIG. 4 schematically depicts an embodiment of a wireless device inaccordance with aspects of the present disclosure.

FIG. 5 schematically depicts an embodiment of an electronic devicehaving a plurality of radiofrequency (RF) devices.

FIGS. 6A-6B schematically depict embodiments of RF devices havingvarious connections.

FIG. 7 schematically depicts an embodiment of an electronic devicehaving a plurality of RF devices.

FIGS. 8A-8D show non-limiting example embodiments of wirebonds arrangedabout active or passive RF devices.

FIGS. 9A-9C show an example sequence of an overmolding process includingwirebonds.

FIG. 10 schematically depicts an embodiment of an electronic devicehaving a plurality of RF devices with wirebond structures in an examplearrangement.

FIG. 11 schematically depicts an embodiment of an electronic devicehaving a plurality of RF devices with wirebond structures in an examplearrangement.

FIG. 12 schematically depicts an embodiment of an electronic devicehaving a plurality of RF devices with wirebond structures in an examplearrangement.

FIGS. 13A-13B provide graphical examples of RF isolation data associatedwith embodiments disclosed herein.

FIGS. 14A depicts an embodiment of an electronic device having aplurality of RF devices and a conductive top layer.

FIG. 14B provides graphical examples of RF isolation data associatedwith the embodiment of FIG. 14A.

FIGS. 15 depicts an embodiment of an electronic device having aplurality of RF devices and a conductive top layer.

FIGS. 16A-16F provide embodiments of conductive to or ground layerisolation techniques.

FIG. 17 depicts an embodiment of an electronic device having a pluralityof RF devices and a plurality of conductive ground layers.

FIG. 18 depicts an embodiment of an electronic device having a pluralityof RF devices and a plurality of conductive ground layers.

FIG. 19 depicts an embodiment of an electronic device having a pluralityof RF devices and a plurality of conductive ground layers.

FIG. 20 illustrates a process for providing RF isolation between aplurality of electronic devices.

DETAILED DESCRIPTION

The headings provided herein are for convenience only and do notnecessarily affect the scope or meaning of the claimed invention.

Disclosed herein are various devices and methodologies for providingradio frequency (RF) isolation or shielding for one or more active or apassive RF devices. For the purpose of description, it will beunderstood that RF can include electromagnetic signals having afrequency or a range of frequencies associated with wireless devices. RFcan also include electromagnetic signals that radiate within anelectronic device, whether or not such an electronic device operates asa wireless device. RF can also include signals or noises typicallyassociated with electromagnetic interference (EMI) effects.

For the purpose of description it will be understood that RF devices caninclude devices configured to operate at RF ranges to facilitatetransmitting and/or receiving of RF signals, as well as devices that caninfluence other devices by, or be influenced by, RF signals or noises.Non-limiting examples of such RF devices can include semiconductor dieswith or without RF circuitry. Non-limiting examples of such RF-relateddevices can include discrete devices such as inductors and capacitors,and even a length of a conductor.

For the purpose of description, it will be understood that the termsisolation and shielding can be used interchangeably, depending on thecontext of usage. For example, an RF device being shielded can include asituation where RF signal from another source is blocked, eitherpartially or substantially fully. In another example, an RF device beingisolated can include a situation where RF signal (e.g., noise oractively generated signal) is blocked, either partially or substantiallyfully, from reaching another device. Unless the context of usagespecifically states otherwise, it will be understood that each of theterms shielding and isolation can include either or both of theforegoing functionalities.

The present disclosure includes descriptions of various examples ofsystems, apparatuses, devices, structures, materials and/or methodsrelated to fabrication of packaged modules having a radio-frequency (RF)circuit and wirebond-based electromagnetic (EM) isolation structures.Although described in the context of RF circuits, one or more featuresdescribed herein can also be utilized in packaging applicationsinvolving non-RF components. Similarly, one or more features describedherein can also be utilized in packaging applications without the EMisolation functionality.

FIG. 1 shows a process 10 that can be implemented to fabricate apackaged module having and/or via one or more features as describedherein. FIG. 2 shows various parts and/or stages of various stepsassociated with the process 10 of FIG. 1.

In block 12 a of FIG. 1, a packaging substrate and parts to be mountedon the packaging substrate can be provided. Such parts can include, forexample, one or more surface-mount technology (SMT) components and oneor more singulated dies having integrated circuits (ICs). FIGS. 2A1 and2A2 show that in some embodiments, the packaging substrate can include alaminate panel 16. FIG. 2A1 shows the example panel's front side; andFIG. 2A2 shows the panel's back side. The panel 16 can include aplurality of individual module substrates 20 arranged in groups that aresometimes referred to as cookies 18.

FIGS. 2B1-2B3 show front, side and back, respectively, of an exampleconfiguration of the individual module substrate 20. For the purpose ofdescription herein, a boundary 22 can define an area occupied by themodule substrate 20 on the panel 16. Within the boundary 22, the modulesubstrate 20 can include a front surface 21 and a back surface 27. Shownon the front surface 21 is an example mounting area 23 dimensioned toreceive a die (not shown). A plurality of example contact pads 24 (e.g.,connection wirebond contact pads) are arranged about the die-receivingarea 23 so as to allow formation of electrical connections between thedie and contact pads 28 arranged on the back surface 27. Although notshown, electrical connections between the wirebond contact pads 24 andthe module's contact pads 28 can be configured in a number of ways. Alsowithin the boundary 22 are two sets of example contact pads 25configured to allow mounting of, for example passive SMT devices (notshown). The contact pads 25 can be electrically connected to some of themodule's contact pads 28 and/or ground contact pads 29 disposed on theback surface 27. Also within the boundary 22 are a plurality of wirebondpads 26 configured to allow formation of a plurality of EM-isolatingwirebonds (not shown). The wirebond pads 26 can be electricallyconnected to an electrical reference plane (such as a ground plane) 30.Such connections between the wirebond pads 26 and the ground plane 30(depicted as dotted lines 31) can be achieved in a number of ways. Insome embodiments, the ground plane 30 may or may not be connected to theground contact pads 29 disposed on the back surface 27.

FIG. 2C shows an example fabricated wafer 35 that includes a pluralityof functional dies 36 awaiting to be cut (or sometimes referred to assingulated) into individual dies. Such cutting of the dies 36 can beachieved in a number of ways. FIG. 2D schematically depicts anindividual die 36 where a plurality of metalized contact pads 37 can beprovided. Such contact pads can be configured to allow formation ofconnection wirebonds between the die 36 and the contact pads 24 of themodule substrate (e.g., FIG. 2B1).

In block 12 b of FIG. 1, solder paste can be applied on the modulesubstrate to allow mounting of one or more SMT devices. FIGS. 2E1 and2E2 show an example configuration 40 where solder paste 41 is providedon each of the contact pads 25 on the front surface of the modulesubstrate 20. In some implementations, the solder paste 41 can beapplied to desired locations on the panel (e.g., 16 in FIG. 2A1) indesired amount by an SMT stencil printer.

In block 12 c of FIG. 1, one or more SMT devices can be positioned onthe solder contacts having solder paste. FIGS. 2F1 and 2F2 show anexample configuration 42 where example SMT devices 43 are positioned onthe solder paste 41 provided on each of the contact pads 25. In someimplementations, the SMT devices 43 can be positioned on desiredlocations on the panel by an automated machine that is fed with SMTdevices from tape reels.

In block 12 d of FIG. 1, a reflow operation can be performed to melt thesolder paste to solder the one or more SMT devices on their respectivecontact pads. In some implementations, the solder paste 41 can beselected and the reflow operation can be performed to melt the solderpaste 41 at a first temperature to thereby allow formation of desiredsolder contacts between the contact pads 25 and the SMT devices 43.

In block 12 e of FIG. 1, solder residue from the reflow operation ofblock 12 d can be removed. By way of an example, the substrates can berun through a solvent or aqueous cleaning step. Such a cleaning step canbe achieved by, for example, a nozzle spray, vapor chamber, or fullimmersion in liquid.

In block 12 f of FIG. 1, adhesive can be applied on one or more selectedareas on the module substrate 20 to allow mounting of one or more dies.FIGS. 2G1 and 2G2 show an example configuration 44 where adhesive 45 isapplied in the die-mounting area 23. In some implementations, theadhesive 45 can be applied to desired locations on the panel (e.g., 16in FIG. 2A1) in desired amount by techniques such as screen printing.

In block 12 g of FIG. 1, one or more dies can be positioned on theselected areas with adhesive applied thereon. FIGS. 2H1 and 2H2 show anexample configuration 46 where an example die 36 is positioned on thedie-mounting area 23 via the adhesive 45. In some implementations, thedie 36 can be positioned on the die-mounting area on the panel by anautomated machine that is fed with dies from a tape reel.

In block 12 h of FIG. 1, the adhesive between the die the die-mountingarea can be cured. Preferably, such a curing operation can be performedat one or more temperatures that are lower than the above-describedreflow operation for mounting of the one or more SMT devices on theirrespective contact pads. Such a configuration allows the solderconnections of the SMT devices to remain intact during the curingoperation.

In block 12 j of FIG. 1, electrical connections such as wirebonds can beformed between the mounted die(s) and corresponding contact pads on themodule substrate 20. FIGS. 211 and 212 show an example configuration 48where a number of wirebonds 49 are formed between the contact pads 37 ofthe die 36 and the contact pads 24 of the module substrate 20. Suchwirebonds can provide electrical connections for signals and/or power toand from one or more circuits of the die 36. In some implementations,the formation of the foregoing wirebonds can be achieved by an automatedwirebonding machine.

In block 12 k of FIG. 1, a plurality of RF-shielding wirebonds can beformed about a selected area on the module substrate 20. FIGS. 2J1 and2J2 show an example configuration 50 where a plurality of RF-shieldingwirebonds 51 are formed on wirebond pads 26. The wirebond pads 26 areschematically depicted as being electrically connected (dotted lines 31)with one or more reference planes such as a ground plane 30. In someembodiments, such a ground plane can be disposed within the modulesubstrate 20. The foregoing electrical connections between theRF-shielding wirebonds 51 and the ground plane 30 can yield aninterconnected RF-shielding structure at sides and underside of the areadefined by the RF-shielding wirebonds 51. As described herein, aconductive layer can be formed above such an area and connected to upperportions of the RF-shielding wirebonds 51 to thereby form an RF-shieldedvolume.

In the example configuration 50, the RF-shielding wirebonds 51 are shownto form a perimeter around the area where the die (36) and the SMTdevices (43) are located. Other perimeter configurations are alsopossible. For example, a perimeter can be formed with RF-wirebondsaround the die, around one or more of the SMT devices, or anycombination thereof. In some implementations, an RF-wirebond-basedperimeter can be formed around any circuit, device, component or areawhere RF-isolation is desired. For the purpose of description, it willbe understood that RF-isolation can include keeping RF signals or noisefrom entering or leaving a given shielded area.

In the example configuration 50, the RF-shielding wirebonds 51 are shownto have an asymmetrical side profile configured to facilitate controlleddeformation during a molding process as described herein. Additionaldetails concerning such wirebonds can be found in, for example, PCTPublication No. WO 2010/014103 titled “SEMICONDUCTOR PACKAGE WITHINTEGRATED INTERFERENCE SHIELDING AND METHOD OF MANUFACTURE THEREOF.” Insome embodiments, other shaped RF-shielding wirebonds can also beutilized. For example, generally symmetric arch-shaped wirebonds asdescribed in U.S. Pat. No. 8,071,431, titled “OVERMOLDED SEMICONDUCTORPACKAGE WITH A WIREBOND CAGE FOR EMI SHIELDING,” can be used asRF-shielding wirebonds in place of or in combination with the shownasymmetric wirebonds. In some embodiments, RF-shielding wirebonds do notnecessarily need to form a loop shape and have both ends on the surfaceof the module substrate. For example, wire extensions with one end onthe surface of the module substrate and the other end positioned abovethe surface (for connecting to an upper conductive layer) can also beutilized.

In the example configuration 50 of FIGS. 2J1 and 2J2, the RF-shieldingwirebonds 51 are shown to have similar heights that are generally higherthan heights of the die-connecting wirebonds (49). Such a configurationallows the die-connecting wirebonds (49) to be encapsulated by moldingcompound as described herein, and be isolated from an upper conductivelayer to be formed after the molding process.

In block 121 of FIG. 1, an overmold can be formed over the SMTcomponent(s), die(s), and RF-shielding wirebonds. FIG. 2K shows anexample configuration 52 that can facilitate formation of such anovermold. A mold cap 53 is shown to be positioned above the modulesubstrate 20 so that the lower surface 54 of the mold cap 53 and theupper surface 21 of the module substrate 20 define a volume 55 wheremolding compound can be introduced.

In some implementations, the mold cap 53 can be positioned so that itslower surface 54 engages and pushes down on the upper portions of theRF-shielding wirebonds 51. Such a configuration allows whatever heightvariations in the RF-shielding wirebonds 51 to be removed so that theupper portions touching the lower surface 54 of the mold cap 53 are atsubstantially the same height. When the mold compound is introduced andan overmold structure is formed, the foregoing technique maintains theupper portions of the encapsulated RF-shielding wirebonds 51 at or closeto the resulting upper surface of the overmold structure.

In the example molding configuration 52 of FIG. 2K, molding compound canbe introduced from one or more sides of the molding volume 55 asindicated by arrows 56. In some implementations, such an introduction ofmolding compound can be performed under heated and vacuum condition tofacilitate easier flow of the heated molding compound into the volume55.

FIG. 2L shows an example configuration 58 where molding compound hasbeen introduced into the volume 55 as described in reference to FIG. 2Kand the molding cap removed to yield an overmold structure 59 thatencapsulates the various parts (e.g., die, die-connecting wirebonds, andSMT devices). The RF-shielding wirebonds are also shown to besubstantially encapsulated by the overmold structure 59. The upperportions of the RF-shielding wirebonds are shown to be at or close tothe upper surface 60 of the overmold structure 59.

FIG. 2M shows an example panel 62 that has overmold structures 59 formedover the multiple cookie sections. Each cookie section's overmoldstructure can be formed as described herein in reference to FIGS. 2K and2L. The resulting overmold structure 59 is shown to define a commonupper surface 60 that covers the multiple modules of a given cookiesection.

The molding process described herein in reference to FIGS. 2K-2M canyield a configuration where upper portions of the encapsulatedRF-shielding wirebonds are at or close to the upper surface of theovermold structure. Such a configuration may or may not result in theRF-shielding wirebonds forming a reliable electrical connection with anupper conductor layer to be formed thereon.

In block 12 m of FIG. 1, a top portion of the overmold structure can beremoved to better expose upper portions of the RF-shielding wirebonds.FIG. 2N shows an example configuration 64 where such a removal has beenperformed. In the example, the upper portion of the overmold structure59 is shown to be removed to yield a new upper surface 65 that is lowerthan the original upper surface 60 (from the molding process). Such aremoval of material is shown to better expose the upper portions 66 ofthe RF-shielding wirebonds 51.

The foregoing removal of material from the upper portion of the overmoldstructure 59 can be achieved in a number of ways. FIG. 20 shows anexample configuration 68 where such removal of material is achieved bysand-blasting. In the example, the left portion is where material hasbeen removed to yield the new upper surface 65 and better exposed upperportions 66 of the RF-shielding wirebonds. The right portion is wherematerial has not been removed, so that the original upper surface 60still remains. The region indicated as 69 is where the material-removalis being performed.

In the example shown in FIG. 20, a modular structure corresponding tothe underlying module substrate 20 (depicted with a dotted box 22) isreadily apparent from the exposed upper portions 66 of the RF-shieldingwirebonds that are mostly encapsulated by the overmold structure 59.Such modules will be separated after a conductive layer is formed overthe newly formed upper surface 65.

In block 12 n of FIG. 1, the new exposed upper surface resulting fromthe removal of material can be cleaned. By way of an example, thesubstrates can be run through a solvent or aqueous cleaning step. Such acleaning step can be achieved by, for example, a nozzle spray, or fullimmersion in liquid.

In block 12 o of FIG. 1, an electrically conductive layer can be formedon the new exposed upper surface of the overmold structure, so that theconductive layer is in electrical contact with the upper portions of theRF-shielding wirebonds. Such a conductive layer can be formed by anumber of different techniques, including methods such as spraying orprinting.

FIG. 2P shows an example configuration 70 where an electricallyconductive layer 71 has been formed over the upper surface 65 of theovermold structure 59. As described herein, the upper surface 65 betterexposes the upper portions 66 of the RF-shielding wirebonds 51.Accordingly, the formed conductive layer 71 forms improved contacts withthe upper portions 66 of the RF-shielding wirebonds 51.

As described in reference to FIG. 2J, the RF-shielding wirebonds 51 andthe ground plane 30 can yield an interconnected RF-shielding structureat sides and underside of the area defined by the RF-shielding wirebonds51. With the upper conductive layer 71 in electrical contact with theRF-shielding wirebonds 51, the upper side above the area is now shieldedas well, thereby yielding a shielded volume.

FIG. 2Q shows an example panel 72 that has been sprayed with conductivepaint to yield an electrically conductive layer 71 that covers multiplecookie sections. As described in reference to FIG. 2M, each cookiesection includes multiple modules that will be separated.

In block 12 p of FIG. 1, the modules in a cookie section having a commonconductive layer (e.g., a conductive paint layer) can be singulated intoindividual packaged modules. Such singulation of modules can be achievedin a number of ways, including a sawing technique.

FIG. 2R shows an example configuration 74 where the modular section 20described herein has been singulated into a separated module 75. Theovermold portion is shown to include a side wall 77; and the modulesubstrate portion is shown to include a side wall 76. Collectively, theside walls 77 and 76 are shown to define a side wall 78 of the separatedmodule 75. The upper portion of the separated module 75 remains coveredby the conductive layer 71. As described herein in reference to FIG. 2B,the lower surface 27 of the separated module 75 includes contact pads28, 29 to facilitate electrical connections between the module 75 and acircuit board such as a phone board.

FIGS. 2S1, 2S2 and 2S3 show front (also referred to as top herein), back(also referred to as bottom herein) and perspective views of thesingulated module 75. As described herein, such a module includesRF-shielding structures encapsulated within the overmold structure; andin some implementations, the overall dimensions of the module 75 is notnecessarily any larger than a module without the RF-shieldingfunctionality. Accordingly, modules having integrated RF-shieldingfunctionality can advantageously yield a more compact assembled circuitboard since external RF-shield structures are not needed. Further, thepackaged modular form allows the modules to be handled easier duringmanipulation and assembly processes.

In block 12 q of FIG. 1, the singulated modules can be tested for properfunctionality. As discussed above, the modular form allows such testingto be performed easier. Further, the module's internal RF-shieldingfunctionality allows such testing to be performed without externalRF-shielding devices.

FIG. 2T shows that in some embodiments, one or more of modules includedin a circuit board such as a wireless phone board can be configured withone or more packaging features as described herein. Non-limitingexamples of modules that can benefit from such packaging featuresinclude, but are not limited to, a controller module, an applicationprocessor module, an audio module, a display interface module, a memorymodule, a digital baseband processor module, GPS module, anaccelerometer module, a power management module, a transceiver module, aswitching module, and a power amplifier module.

FIG. 3A shows a process 80 that can be implemented to assemble apackaged module having one or more features as described herein on acircuit board. In block 82 a, a packaged module can be provided. In someembodiments, the packaged module can represent a module described inreference to FIG. 2T. In block 82 b, the packaged module can be mountedon a circuit board (e.g., a phone board). FIG. 3B schematically depictsa resulting circuit board 90 having module 91 mounted thereon. Thecircuit board can also include other features such as a plurality ofconnections 92 to facilitate operations of various modules mountedthereon.

In block 82 c, a circuit board having modules mounted thereon can beinstalled in a wireless device. FIG. 3C schematically depicts a wirelessdevice 94 (e.g., a cellular phone) having a circuit board 90 (e.g., aphone board). The circuit board 90 is shown to include a module 91having one or more features as described herein. The wireless device isshown to further include other components, such as an antenna 95, a userinterface 96, and a power supply 97.

FIG. 4 illustrates a more detailed block diagram of an embodiment of awireless device 194 in accordance with one or more aspects of thepresent disclosure. Applications of the present disclosure are notlimited to wireless devices and can be applied to any type of electronicdevice, with or without a power amplifier or power amplifier module. Forexample, embodiments can be applied to wired devices, weather sensingdevices, RADAR, SONAR, microwave ovens, and any other device that mightinclude functionality similar to that provided by the various blocksshown in FIG. 4. Further, embodiments of the present disclosure can beapplied to devices that may include one or more components controlledvia a front end interface. Although the present disclosure is notlimited to wireless devices or devices containing power amplifiers, tosimplify discussion, a number of embodiments will be described withrespect to the wireless device 194 and power amplifier module 191.

The wireless device 194 can include a power amplifier module 191. Thepower amplifier module 191 can generally include any component or devicethat includes a power amplifier. In certain embodiments, the poweramplifier module 191 includes multiple power amplifiers. For example,the power amplifier module 191 may include separate power amplifiers foramplification of signals conforming to one or more different wirelessdata transmission standards, such as GSM, WCDMA, LTE, EDGE, etc.Furthermore, the power amplifier module 191 may be combined with thetransceiver circuit 120 in a single module. Power amplifiersincorporated in the power amplifier module 191 may be single-stage ormulti-stage power amplifiers, as desired.

The power amplifier module 191 may include a power amplifier controllerfor controlling the power amplifier. Although not limited as such,controlling the power amplifier module 191 generally refers to setting,modifying, or adjusting the amount of power amplification provided byone or more power amplifiers of the power amplifier module 191. Thepower amplifier module 91 may be a single component that includes thefunctionality of a power amplifier controller and one or more poweramplifiers. In other implementations, the wireless device 194 mayinclude separate power amplifier control circuitry and poweramplifier(s).

The wireless device 194 may include one or more additional RFcomponents, such as the transceiver circuit 120. In certain embodiments,the wireless device comprises a plurality of transceiver circuits, suchas to accommodate operation with respect to signals conforming to one ormore different wireless data communication standards. The transceivercircuit 120 may serve as a signal source that determines or sets a modeof operation of one or more components of the power amplifier module 91.Alternatively, or in addition, baseband circuit 150, or one or moreother components that are capable of providing one or more signals tothe power amplifier module 91 may serve as a signal source provided topower amplifier module 91.

The transceiver circuit 120 and/or power amplifier module 91 may beelectrically coupled to the baseband circuit 150, which processes radiofunctions associated with signals received and/or transmitted by one ormore antennas (e.g., 195, 196). Such functions may include, for example,signal modulation, encoding, radio frequency shifting, or otherfunction. The baseband circuit 150 may operate in conjunction with areal-time operating system in order to accommodate timing dependentfunctionality. In certain embodiments, the baseband circuit 150 includesor is connected to a central processor. For example, the basebandcircuit and central processor may be combined (e.g., part of a singleintegrated circuit), or may be separate modules or devices.

The baseband circuit is connected, either directly or indirectly, to amemory module 140, which contains one or more volatile and/ornon-volatile memory, or data storage, devices or media. Examples oftypes of storage devices that may be included in the memory module 140include Flash memory, such as NAND Flash, DDR SDRAM, Mobile DDR SRAM, orany other suitable type of memory, including magnetic media, such as ahard disk drive. Furthermore, the amount of storage included in memorymodule 140 may vary based on one or more conditions, factors, or designpreferences. For example, the memory module 140 may containapproximately 256 MB, or any other suitable amount of storage, such as 1GB or more. The amount of memory included in wireless device 194 maydepend on factors such as, for example, cost, physical space allocation,processing speed, etc.

The wireless device 194 includes a power management module 97. The powermanagement module includes, among possibly other things, a battery orother power source. For example, the power management module 197 mayinclude one or more lithium-ion batteries. In addition, the powermanagement module 97 may include a controller module for management ofpower flow from the power source to one or more devices of wirelessdevice 94. Although the power management module 97 may be describedherein as including a power source in addition to a power managementcontroller, the terms “power source” and “power management,” as usedherein, may refer to either power provision, power management, or both,or any other power-related device or functionality.

The wireless device 94 may include one or more audio components 170.Example components may include one or more speakers, earpieces, headsetjacks, and/or other audio components. Furthermore, the audio componentmodule 170 may include audio compression and/or decompression circuitry(i.e., “codec”). An audio codec may be included for encoding signals fortransmission, storage or encryption, or for decoding for playback orediting, among possibly other things.

The wireless device 194 includes connectivity circuitry 130 comprisingone or more devices for use in receipt and/or processing of data fromone or more outside sources. To such end, the connectivity circuitry 130may be connected to one or more antennas 196. For example, theconnectivity circuitry 130 may include one or more power amplifierdevices, each of which is connected to an antenna. The antenna 196 maybe used for data communication in compliance with one or morecommunication protocols, such as Wi-Fi (i.e., compliant with one or moreof the IEEE 802.11 family of standards) or Bluetooth, for example.Multiple antennas and/or power amplifiers may be desirable toaccommodate transmission/reception of signals compliant with differentwireless communications protocols. Furthermore, the connectivitycircuitry 130 may include a Global Positioning System (GPS) receiver.

The connectivity circuitry 130 may include one or more othercommunication portals or devices. For example, the wireless device 194may include physical slots, or ports, for engaging with Universal SerialBus (USB), Mini USB, Micro USB, Secure Digital (SD), miniSD, microSD,subscriber identification module (SIM), or other types of devices

The wireless device 194 includes one or more additional components 180.Examples of such components may include a display, such as an LCDdisplay. The display may be a touchscreen display. Furthermore, thewireless device 194 may include a display controller, which may beseparate from, or integrated with, the baseband circuit 150 and/or aseparate central processor. Other example components that may beincluded in the wireless device 194 may include one or more cameras(e.g., cameras having 2 MP, 3.2, MP, 5 MP, or other resolution),compasses, accelerometers, optical sensors, or other functional devices.The wireless device 194 can include a number of additional components.At least some of these additional components may receive power from thepower management module 160. For example, the wireless device 194 caninclude a digital to analog convertor (DAC), a user interface processor132, and/or an analog to digital convertor (ADC), among possibly otherthings.

The components described above in connection with FIG. 4 and thewireless device 194 are provided as examples, and are non-limiting.Moreover, the various illustrated components may be combined into fewercomponents than illustrated in FIG. 4, or separated into additionalcomponents. For example, the baseband circuit 150 can be combined withthe transceiver circuit 120. As another example, the transceiver 120 canbe split into separate receiver and transmitter modules.

Intramodule Shielding

FIG. 5 schematically depicts an electronic device 591 having a pluralityof packaged components (510, 520, 530), such as chips. The chips 510,520, 530 may include one or more RF devices. The chips 510, 520, forexample, may comprise switches connected to input and/or output ports515 and 525, respectively. In certain embodiments, the ports 515 and 525are each connected to an antenna (not shown), or other external RFinfluence. The switches 515, 525 may be configured to relay a signal, ora modified signal, from the respective antennas to an amplifier device530 along transmission lines 517 and 527. The amplifier 530 may providea signal to an output port 535 for use by a wireless device.

In certain embodiments, the electronic device 591 may be configured tooperate while receiving signals on more than one input line. Theswitches 510 and 520 may be configured such that one of the inputsignals is transmitted, but not the other. However, physical proximity,as well as other factors, may contribute to undesirable RF influencebetween RF devices. For example, signal input to switch 2 that is notrelayed to the amplifier 530, may interfere with signal input to switch510 that is desirably passed on to amplifier 530. Therefore, it may bedesirable to provide RF isolation between one or more of the devicesdepicted in FIG. 5 in order to improve performance of the electronicdevice 591 under certain conditions.

FIGS. 6A and 6B provide block diagrams representing certain embodimentsof configurations of RF devices, specifically, the devices labeled “Port1” 610, “Port 2” 620, and “Port 3” 630. The devices 610, 620, and 630may be disposed on a single semiconductor die, or may be components ofseparate structures. Each of the devices depicted may be electricallyconnected to one or more other devices not shown. For example, Ports 1and 2 may each be connected to Port 3 via conductive channels or paths,identified by reference numbers 617 and 627 respectively. In FIGS. 6Aand 6B, dashed connecting lines indicate a connection that has beenimpeded, obstructed, or disconnected in some manner, such as throughactivation or deactivation of an electrical switch. Therefore, as shown,the embodiment depicted in FIG. 6A includes a configuration in which anelectrical channel 617 is open between Port 1 and Port 3, while thechannel 627 between Port 2 and Port 3 is switched “off,” or closed tosome degree. The reverse configuration is depicted in FIG. 6B, where thechannel 627 between Port 2 and Port 3 is open, while the channel 617between Port 1 and Port 3 is closed.

As described above, wires associated with RF devices emit/radiate powerthat can cause electromagnetic interference (EMI) when such power is notdrawn to ground sufficiently, resulting in cross-talk between ports.Therefore, it may be necessary or desirable, depending on systemneeds/requirements, to prevent three-dimensional (3D) coupling betweenthe various ports illustrated in FIGS. 6A and 6B. In certainembodiments, although the electrical connection between two ports (e.g.,conductive path 627 between Ports 1 and 3) may be in an off state, theremay still be a constant signal present between the two ports. Forexample, in an embodiment, a wireless device includes multiple antennas,each providing a signal source that can be relayed to Port 3 via one ofthe other ports. Such antennas and/or ports may continue to operate orreceive a signal when the conductive path associated with suchantennas/ports is turned off. Such undesirable signal can advantageouslybe directed to electrical ground in order to reduce interference withother modules or devices. However, in certain embodiments, theelectrical ground connection available is inadequate to discharge theunwanted EMI.

It may be undesirable for an open communication channel between RFdevices to experience interference from other RF devices. For example,in the embodiment of FIG. 6A, data communication may be desirablycarried out between Port 1 and Port 3. However, if Port 2 is alsoreceiving or carrying a signal, such a signal may interfere to someextent with communication between Port 1 and Port 3, in spite of channel627 being switched off. Such interference can be the result of parasiticharmonics propagating between devices. Interference can introduceunwanted, or unacceptable, noise into the system, depending on thespecific system characteristics or requirements. Therefore, RF isolationbetween one or more of the devices shown may be desirable or necessary.

Intramodule Shielding Walls

FIG. 7 provides a block diagram of an packaged module 791 with aplurality of RF devices disposed thereon, 710, 720, and 730. The dashedlines identified by reference number 751 represent planes, or barriersbetween the various RF devices that may provide at least partial RFisolation between the devices. In certain embodiments, one or moreRF-shielding structures 751 are formed adjacent to one or more of thedevices so as to provide RF isolation properties. In someimplementations, the RF-shielding structure can be configured to provideRF isolation functionality, such as isolating a device from an RFinfluence of another device on the packaged module 791, isolating thedevice from an external RF influence originating from outside thepackaged module 791, and/or preventing escape of RF signals or noisesfrom the device to regions such as other devices and/or external RFsources (not shown).

RF isolation between two devices may be accomplished in a number ofways. For example, in certain embodiments, metal cans may be placedaround one or more devices, shielding RF interference from or by suchdevices. In certain embodiments, physical separation of modules mayprovide some amount of RF isolation between devices. Therefore, it maybe desirable to position devices on a single module as far from oneanother as practical in order to reduce interference. However, modulesize constraints may impede the ability to achieve satisfactoryisolation using this technique alone. For example, a single board maynot be large enough to provide adequate physical separation to meetisolation needs of a system using physical separation alone.

As described in some detail above with respect to FIGS. 1-3, in certainembodiments, at least partial RF isolation between two or more devicemay be achieved using wirebond structures. In certain embodiments,wirebonds are disposed between devices on a single packaged substrate791. For example, wirebond structures may be placed on the substratebetween devices 710, 720 and 730, such as along lines 751, or in someother configuration. The wirebonds may combine with one or moreconductive layers, such as conductive top and/or ground layers to atleast partially form a Faraday cage around or between one or moredevices disposed within a single packaged module.

In some implementations of devices incorporating RF isolation usingwirebond structures in accordance with embodiments disclosed herein,some or all of the wirebonds can be arranged about an RF device. Such anarrangement may take on a number of different forms or configurations.FIGS. 8A-8D show some non-limiting examples of such arrangements. Insome embodiments, some or all of such wirebonds are constructedsimilarly to certain structures described in U.S. Publication No. US2007/0241440 (U.S. application Ser. No. 11/499,285, filed on Aug. 4,2006, titled “OVERMOLDED SEMICONDUCTOR PACKAGE WITH A WIREBOND CAGE FOREMI SHIELDING”), International Publication No. WO 2010/01 41 03(International Application No. PCT/US2008/071832, filed on Jul. 31,2008, titled “SEMICONDUCTOR PACKAGE WITH INTEGRATED INTERFERENCESHIELDING AND METHOD OF MANUFACTURE THEREOF”), or some combinationthereof. The foregoing publications are hereby expressly incorporated byreference in their entirety. By applying wirebond and other isolationtechniques to an RF module, it may be possible to isolate specificsubsections of the module by creating a 3D wall between the varioussubsections. Such a wall may at least partially prevent radiatedcoupling of RF signals between the various subsections. An isolationwall may consist of both the substrate and bond wires. Depending on theisolation requirement needed by the system, multiple rows of wires canbe added.

In an example configuration 800 shown in FIG. 8A, an RF device 810 isdepicted as being surrounded by a plurality of wirebonds 851 arranged ina rectangular box-shaped pattern. For each side of the rectangle, thewirebonds 851 can be oriented so that planes defined by the wirebondsare generally aligned along the side of the rectangle. The dimensions ofeach wirebond and spacings between the wirebonds can be selected toprovide desired RF isolation functionality.

In an example configuration 802 shown in FIG. 8B, an RF device 820 isdepicted as being surrounded by a plurality of wirebonds 852 a arrangedin a rectangular box shaped pattern, similar to the example of FIG. 8A.For each side of the rectangle, a number of wirebonds 852 can beoriented so that planes defined by such wirebonds are generally alignedalong the side of the rectangle. Additional wirebonds 852 b are shown tobe positioned at each of the corners so as to provide a narrower gapbetween the end wirebonds of the two adjacent sides. In the exampleshown in FIG. 8B, each of the corner wirebonds is shown to be orientedsuch that its plane divides the angle defined by the corner. Thedimensions of each wirebond, and spacings between the wirebonds, can beselected to provide desired RF isolation functionality.

In the example configuration 804 shown in FIG. 8C, an RF device 830 isdepicted as being surrounded by a plurality of wirebonds 853 in arectangular box shaped pattern. For each side of the rectangle, thewirebonds 853 can be oriented so that planes defined by the wirebondsare generally perpendicular to the side of the rectangle. The dimensionsof each wirebond and spacings between the wirebonds can be selected toprovide desired RF isolation functionality.

In the examples described in reference to FIGS. 8A-8C, the wirebondsdepicted are arranged in a single row at a given side. FIG. 8D showsthat in some implementations, more than one row of wirebonds can beprovided. In an example configuration 806, first and second rows 854,855 of wirebonds are shown to be disposed adjacent to an RF device 840.In the example shown, the two rows of wirebonds are staggered so as toprovide additional RF isolating capability. The example rows ofwirebonds may or may not extend fully around the RF device 840. Thedimensions of each wirebond, spacings between the wirebonds in a givenrow, and spacing between adjacent rows can be selected to providedesired RF isolation functionality.

In some implementations, a given area of a packaged substrate can havemore than one wirebond structure. As an example, a first wirebond, suchas an arch shaped wirebond similar to that described in U.S. PublicationNo. US 2007/0241440, can be provided at a given area; a second wirebondsimilar to that described in International Publication No. WO2010/014103 can be provided so as to be over and encompassing the firstwirebond. These references are hereby incorporated by reference in theirentirety into the present disclosure. The first wirebond can bedimensioned so as to fit within an interior space defined by the secondwirebond; such dimensions of the first wirebond can be selected toprovide an increased RF isolating capability in the interior space ofthe second wirebond. Various other wirebond configurations may beimplemented, as suitable for particular applications.

FIGS. 9A-C depict various aspects of structure and methods of wirebondRF isolation. Referring to FIG. 9A, a number of wirebonds 951 are shownto be formed on a substrate layer about or adjacent to an RF device 910.Again, it will be understood that the RF device 910 can be a passivedevice or an active device as described herein. As illustrated in FIG.9B, an overmold layer 977 may be formed over one or more of thewirebonds 951, as well as the RF device 910. For the purpose ofdescription of embodiments herein, terms such as “over,” “under,”“lower,” “upper,” “top,” “bottom,” and others are sometimes used in thecontext of the example orientations of different parts. It will beunderstood, however, that the packaging process does not necessarilyneed to be performed in such orientations; thus, such terms are notintended in any manner to limit the various concepts of the presentdisclosure.

For the purpose of description, a wirebond may include a wire formedfrom metals such as gold, aluminum or copper. Such metal wires can bedimensioned (e.g., diameter) and configured appropriately so as to allowformation of wirebond structures.

Common wirebonding processes can include, for example, gold ballwirebonding and aluminum wedge bonding. In the context of the examplegold ball wirebonding, a gold ball can be formed at the end of a goldwire held by a bonding tool commonly referred to as a capillary whichcan be part of a wirebonding head assembly. The gold ball, also referredto as a free-air ball, can be formed by a melting process such as anelectronic flame-off process. The free-air ball can then be brought intocontact with a bonding pad, and an appropriate combination of pressure,heat and/or ultrasonic forces can be applied to the ball for a selectedamount of time so as to form the initial metal weld between the wire andthe bond pad. The wire can then be dispensed through the capillary.

In some situations, upper portions 966 of wirebonds can remain exposedat the upper surface of an overmold 977 so as to allow electricalconnection of the wirebonds with a conductive layer (971 in FIG. 9C),which is discussed in greater detail below. However, in some situations,the upper portions 966 of the wirebonds may become buried within theovermold 977 during the molding process, or only a small number of suchupper portions may be exposed. In such situations, an upper portion ofthe overmold 977 can be removed so as to expose a greater number of theupper portions 966 of the wirebonds. Such removal of the overmold'supper portion can be achieved in a number of ways, including laserabrasion, mechanical milling, diamond polishing, etc.

FIG. 9B shows an example result of such a removal process, where a newupper surface 977 can be formed so as to expose more or all of the upperportions (depicted as 966) of the wirebonds. In FIG. 9C, a conductivelayer 971 is depicted as being formed or disposed on an upper surface ofthe overmold 977 so as to make electrical contacts with the upperportions 966 of the wirebonds.

While the illustrated embodiment depicts a plurality of wirebondstructures connecting the conductive top layer 971 with a ground plane(not shown), certain embodiments include fewer or more conductive pathsconnecting the top layer to ground. For example, a single wall orconnection point may provide a relatively strengthened ground plane,thereby improving interference attenuation. In cases including few orsparsely populated walls/connection points, EMI shielding may be lesseffective due to lack of complete Faraday containment. Therefore, incertain embodiments, wirebond structures are advantageously disposedwithin a close enough proximity to effectively provide 3D interferenceblocking.

Use of wirebonds for EMI shielding, as opposed to, for example, metalcans, may provide cost advantages associated with material and/ormanufacturing costs. In addition, metal can embodiments may also presentspacing disadvantages, wherein module size may prevent or impededesirable isolation. In certain embodiments, wirebond shielding utilizesless physical space than certain metal can shielding techniques.

FIG. 10 illustrates a block diagram of a wireless module 1091 includinga plurality of RF devices, 1010, 1020 and 1030. In certain embodiments,the wireless module 1091 includes one or more wirebond structures, orrows of wirebond structures 1050, 1055 disposed at least partiallybetween two or more of the RF devices 1010, 1020, 1030. For example, asshown, wirebond row 1050 is positioned between devices 1010 and 1020.Wirebond row 1050, possibly in combination with one or more top, ground,or other conductive layers, may at least partially form an RF barrierbetween devices 1010 and 1020. For example, wirebond row 1050 may assistin attenuating, impeding, or substantially eliminating unwanted RFsignal bleeding between the devices 1010, 1020. Therefore, the wirebondstructures 1050 provide 3D shielding between a plurality of RF devicesdisposed on a single substrate. For example, in an embodiment where achannel between device 1010 and device 1030 desirably allows fortransmission of data or power between the devices 1010 and 1030,interference with such transmission may be at least partially blocked byone or both of the wirebond rows 1050, 1055. In certain embodiments,wirebond rows may lie along substantially straight lines, and may besubstantially perpendicular in relative alignment, as shown.

FIG. 11 illustrates a block diagram of a wireless module 1191 includinga plurality of RF devices 1110, 1120, and 1130. In certain embodiments,the wireless module 1191 includes one or more wirebond structures, orrows of wirebond structures 1150, 1155, 1157 for at least partiallyisolating one or more of the RF devices 1110, 1120, 1130 from oneanother, or from external influences. As shown in the embodiment of FIG.11, RF isolation structure, such as wirebonds 1150, may fully orpartially surround one or more devices disposed on a single substrate ormodule. For example, RF isolation structure 1150 may comprise a row, orcollection of rows, of wirebond structures configured such thatsubstantially all portions of the RF device 1110 are shielded fromexternal signals. Similar shielding structure may be configured aroundsome or all of one or more other devices 1120, 1130 disposed within themodule 1191.

FIG. 12 illustrates a block diagram of an electronic device 1221including a plurality of RF devices 1210, 1220, 1230 disposed thereon.In certain embodiments, the electronic device 1291 includes one or morewirebond structures, or rows of wirebond structures 1251 for at leastpartially isolating one or more of the RF devices 1210, 1220, 1230 fromone another, or from external influences. The wirebond structures 1251may be arranged in some configuration designed to impede thetransmission of interference between the devices. For example, thewirebond structures 1251 illustrated may be configured to isolate thedevice 1210 from both the device 1220 and the device 1230. The wirebondstructures may take the form of staggered wire wickets having openingsconfigured to prevent propagation of electromagnetic interferencetherethrough. Although the wirebonds 1251 are illustrated disposed inthe configuration shown, they may be disposed in any suitable ordesirable arrangement or layout. For example, additional wirebonds maybe disposed between the devices 1220 and 1230.

FIGS. 13A-B provide example graphical RF isolation data associated withembodiments disclosed herein. The graph of FIG. 13A represents potentialinterference data that may be associated with an RF device similar tothat shown in FIG. 12, without wirebonds 1251 disposed thereon. FIG.13B, in contrast, provides potential RF interference data for a devicesimilar to that shown in FIG. 12, including wirebond isolation structure1251 disposed thereon. Each of the two figures provides a graphrepresenting interference between devices 1220 and 1210 (1321 a, 1321b), as well as a graph representing interference between devices 1230and 1220. The data associated with the graphs is shown on the right sideof the page (1305, 1306, 1307, 1308). As shown in the figures,introducing wirebond structures like that shown in FIG. 12 may provideisolation improvements in interference shielding by approximately 1 dBor more in certain embodiments. For example, the data shown describesisolation of approximately −68.3 dB at 2.0 GHz (see 1306) for anembodiment without the wirebond structures, and isolation ofapproximately −69.5 dB at the same frequency with the wirebondstructures.

Although FIGS. 13A and 13B demonstrate improved performance with regardto interference attenuation for a packaged component utilizing wirebondisolation structures, adding wirebond structures as described hereinbetween devices is not the only method disclosed herein for improved RFisolation between regions or devices disposed on a single substrate. Incertain embodiments, wirebond concepts disclosed herein may be combinedwith one or more other RF-shielding methods or mechanisms to greatlyimprove shielding performance. FIG. 14A illustrates an embodiment of apackaged component having a conductive layer 1471 disposed above one ormore RF devices on a substrate situated on an overmold (not shown inFIG. 14A). The conductive layer may comprise conductive plating or paintdisposed above a top surface of a substrate. The conductive layer 1471may be situated over a device 1410, as well as various bond pads,wirebonds 1451, and at least a portion of the substrate 1491. In certainembodiments, the conductive layer 1471 can comprise a conductivecoating, such as a conductive ink or paint, which can include copper,silver, or other conductive metals. In another embodiment, conductivelayer 1471 can comprise a layer of copper, aluminum, or other suitablemetal.

In an embodiment in which the conductive layer 1471 comprises a layer ofmetal, the layer of metal can be deposited on top surface of anovermold, like overmold 977 shown in FIG. 9B, and on exposed centerportions of wirebonds, like the exposed wirebond portions 966. Theconductive layer 1471 may be deposited by utilizing a chemical vapordeposition (CVD) process or other suitable deposition processes. Incertain embodiments, conductive layer 1471 is a highly conductivecoating that can be utilized in high volume, precise spray applicationson circuit boards and semiconductor packages. Such coating may at leastpartially provide board-level or package-level EMI shielding ofelectrical components. Certain embodiments utilize a conductive paintlayer 1471 in place of stamped metal cans, wherein use of the conductivepaint rather than metal cans for EMI shielding provides reduced boardspace occupation and reduced cost of board-level EMI shielding. Incertain embodiments, the conductive layer is a silver-filledpolyurethane paint coating.

FIG. 14B provides data demonstrating potential increase in RF isolationperformance of a device utilizing wirebonds and an upper conductivelayer over one or a plurality of devices disposed on a single substrate.The figure provides a graph representing interference between devices1420 and 1410, as well as a graph representing interference betweendevices 1430 and 1420 of FIG. 12. The data associate with the graphs isshown on the right side of the page (1405, 1406). As shown in thefigures, introducing a conductive top layer above one of the devices,like that shown in FIG. 14A may provide isolation improvements ininterference shielding by approximately 10-15 dB or more relative to adevice with no conductive top layer. For example, the data showndescribes isolation improvement of approximately −81.744 dB at 2.0 GHz(see 1406).

Segmented Conductive TOP Layer

FIG. 15 illustrates an embodiment of a packaged component 1591 includinga plurality of RF devices disposed thereon (1510, 1520, 1530). Thepackaged component 1500 includes a conductive top layer 1571 covering aregion of the substrate 1591 above more than one RF device. As describedabove, the presence of the top conductive layer 1571 may provide variousbenefits associated with RF shielding. However, in certain embodiments,the presence of a singular, continuous top conductive layer 1571extending over an area covering separate RF devices can lead to someamount of harmonic interference between the devices over the conductivetop layer. Therefore, it may be desirable to reduce such harmonicinterference by at least partially isolating portions of the topconductive layer 1571 from one another. For example, gaps or breaks in aconductive layer may isolate the ground and impede mobility of freecarriers or unwanted signals traveling from one region of the conductivelayer to another.

Gaps or breaks in a conductive layer may be formed in any suitable orpractical manner. For example, a conductive layer may be cut using sawor laser. In certain embodiments, a top conductive layer is cut to adepth of approximately 20-30 μm. Such cutting may penetrate into asubstrate disposed below the conductive layer. It may be advantageous toimplement such cutting without burning the conductive layer.Furthermore, the sides of the conductive layer created through cuttingmay advantageously be substantially straight.

FIGS. 16A-F illustrate examples of top conductive layer embodiments inwhich the top layer is patterned into subsections in order to at leastpartially isolate one subsection from another. In certain embodiments,each subsection, or one or more subsections, of a top conductive layerincludes its own separate path to ground with respect to othersubsections. Such separation, or isolation, can greatly reduceinter-device interference in a packaged component. The various referencenumbers beginning with 1671 identify different subsections of thevarious top players illustrated. Each of the illustrated embodimentsincludes one or more breaks or gaps in the conductive layer (1601-1606)which serve to isolate subsections from one another. Such gaps or breaksare formed in any suitable manner. For example a top conductive layermay be subjected to etching, or laser ablation, wherein voids or gapsare formed according to a desired configuration or arrangement.

As shown, the embodiment of FIG. 16A includes three distinct subsections1671A separated by one or more gaps 1601. FIG. 16B illustrates anembodiment in which a top conductive plane is separated into twosubsections 1671B. In certain embodiments, the various subsections maybe of uniform shape or area, such as that shown in FIG. 16B. In certainembodiments, it may be desirable to isolate a particular RF device ordevices by creating an isolating perimeter 1603 around at least aportion of the device, as shown in FIG. 16C. FIG. 16D likewisedemonstrates an embodiment in which a particular subsection is isolatedfrom the remainder of the top conductive layer. However, in someembodiments, it is not necessary to create a perimeter of isolationaround the device where a region associated with the device effectivelyabuts an outside surface of the packaged component. As shown in FIG.16E, RF isolation gaps in conductive layers may take any desirable shapeor form, depending on the device and/or specifications to which it issuited. As shown in FIG. 16F, a conductive layer may include a number ofsubsections, such as four or more discrete subsections 1671 F, in orderto advantageously provide relative isolation for a number of RS devicesor components.

Segmented Reference Plane

As described above, a packaged component including a plurality of RFdevices may comprise one or more ground/reference potential planes(e.g., constant DC plane) disposed beneath one or more RF devices. Whilean electrical ground plane may provide common electrical potential forone or more devices of the packaged component, similarly to theconductive top layer discussed above, a conductive crown layer may, incertain embodiments, facilitate the movement of free carriers between RFdevices when multiple RF devices share a single ground plane. Therefore,ground plane isolation may provide yet another mechanism by whichinter-device RF interference can be reduced.

Certain RF modules are sensitive to sharing a common ground; it may bedesirable to avoid conductive coupling within the shared ground path.For example, a module may require separate analog and digital groundplanes. Another possibility is that a single module has multiple RF(Radio frequency) paths. This can occur, for example, in 3/4G cellphones that contain multiple frequency bands. These paths may need to besubstantially or completely isolated away from each other. One approach,as described herein, is to isolate the ground paths for each path sothat the possibility of cross coupling is reduced.

The amount of potential EMI power pulled to ground may depend on howstrong ground is. Separation of subsections of conductive top and/orground planes can improve grounding properties of a packages substrate.In order to prevent/reduce conductive coupling within the shieldedmodule, separation of one of the substrate ground or top layers may notbe adequate, wherein other conductive layers are shared. By patterningthe top conductive layer and ground layer into specific subsections,more complete isolation of separate conductive paths within a module maybe achieved. In certain embodiments, each subsection comprises its ownseparate path to ground.

With respect to packages modules disposed in wireless devices, separateconductive/ground layers may eventually combine. In general, the greaterthe degree of separation between conductive layers, the better theresulting isolation. However, EMI shielding using methods disclosedherein (i.e., wirebond formation, separation of top conductive layer,separation of ground layer) can present certain associated costs to beconsidered. Therefore, the mechanisms and techniques described hereinmay be combined or utilized in order to achieve a desired level ofisolation, while providing a solution that also meets particular costconsiderations. The various techniques may be added and/or adjusted in asystem to effectively tune the isolation properties of the module tomeet implementation needs. For example, in an embodiment, a module mayinclude wirebond structures as well as either subdivided top or groundlayers, but not both, wherein the resulting isolation of the devices ofinterest is sufficient to meet module specifications. By notimplementing all three techniques, manufacturing costs may be saved. Asanother example, a packaged module may include subdivided top and groundlayers, but no wirebond shielding. Alternatively, a module mayincorporate a single technique described herein individually. If suchembodiments provide adequate isolation, they may be suitable ordesirable options rather than full isolation including all techniquesdescribed herein.

A ground plane of a packaged component may be divided into subsectionsor regions in any suitable manner, such as is described above withrespect to isolation of conductive top layers in FIGS. 16A-F. Forexample, separate RF devices may each be disposed above separate groundplanes, such as one ground plane per RF device. In certain embodiments,additional ground plane subsections are also present. FIG. 17illustrates an embodiment of a layout of a packaged component comprisinga plurality of RF devices (1710, 1720, 1730). As shown in the figure,each of the RF devices has associated therewith a separate ground plane(1701, 1702, 1703). Furthermore, the depicted embodiment comprisesadditional ground planes 1704, 1705.

As described above, ground plane segmentation may be utilized with orwithout corresponding top layer segmentation. In certain embodiments, atop conductive layer is patterned in a similar pattern as a groundplane, wherein separate subsections of top conductive layer correspondto separate subsections of conductive ground plane.

In certain embodiments, as is shown in FIG. 18, a separate ground plane801 may extend substantially beyond the perimeter of an RF device 1810electrically coupled thereto. Indeed, ground planes may occupy anydesirable shape or space. Furthermore, as shown in FIG. 19, a singlesubsection of a ground plane may be electrically coupled to a pluralityof RF devices. For example, in certain embodiments, it may be ofparticular interest to isolate a first device 1910 from neighboringdevices 1920 1930. Therefore, as shown in FIG. 19, a first separateground plane may be associated with the first device, and a second withone or more other RF devices.

FIG. 20 provides a flowchart for a process of electrically isolating aplurality of devices disposed in a single package substrate. Althoughthe various blocks of the process 2000 are illustrated in a particularorder, such order is provided for convenience only, and the steps of theprocess 2000 may be performed in any desirable manner and still fallwithin the scope of the present disclosure. The process 2000 may includemounting one or more dies on a packaging substrate. As shown in thefigure, this step is performed at block 2002. The dies may be separateRF devices configured to be disposed on a single packaging substrate.The process 2000 further includes forming one or more isolated groundplanes. The ground planes, as described above, may be associated withvarious dies or devices disposed on the packaging substrate, providing avoltage reference point to one or more of the devices disposed on thepackaging substrate. The formation of ground planes is performed atblock 2004. One or more electrical connections may be formed betweendies mounted on the packaging substrate and the one or more isolatedground planes, as depicted in block 2006.

Three-dimensional isolation between dies mounted on the packagingsubstrate may also be formed or disposed in the packaging substrate atblock 2008. As described above, such isolation structure may take theform of one or more wire bonds configured to provide shielding from RFinterference. At block 2010, a mold is formed around one or morecomponents disposed on the packaging substrate.

A top surface of the mold may have a conductive layer disposed thereon,such as a conductive top layer as described above. At block 2014, atleast a portion of the conductive layer formed at block 2012 issubdivided into subsections of the conductive layer, wherein theisolated subsections are separated or divided by some type ofconduction-inhibiting matter or physical gap. For example, suchisolation may be achieved through etching or the like of the topconductive layer. Electronic devices constructed according to theprocess 2000 may advantageously achieve inter-device interferenceshielding, thereby improving aspects of the operation of the device.

Embodiments disclosed herein may provide the ability to isolatesensitive subsection within a module in order to minimize conductivecoupling within the module. Furthermore, various techniques describedherein (i.e., wirebond formation, separation of top conductive layer,separation of ground layer) may be selectively chosen in order to tuneisolation properties of the module to meet system requirements.Effectively, the present disclosure allows for custom tailoring of EMIisolation vis-à-vis performance, cost, space, and/or otherconsiderations.

Shielded modules described herein may achieve EMI shield having a lowmanufacturing cost compared to a conventional prefabricated metalshield. Additionally, the conductive layer described herein may besignificantly thinner than metal utilized to form conventionalprefabricated metal can shielding. Therefore, the resulting EMI shieldmay comprise a thinner overmolded package compared to an overmoldedpackage that includes a conventional prefabricated metal can.

While various embodiments of RF isolation have been described, it willbe apparent to those of ordinary skill in the art that many moreembodiments and implementations are possible. For example, embodimentsof RF isolation structures and techniques are applicable to differenttypes of devices (e.g., power amplifiers, now-noise amplifiers,switches, passive devices, etc.) and are applicable to any devicecircuitry. In addition, embodiments of RF isolation structures areapplicable to systems where cross-device interference attenuation isdesired.

Some of the embodiments described herein can be utilized in connectionwith wireless devices such as mobile phones. However, one or morefeatures described herein can be used for any other systems or apparatusthat utilize of RF signals or can be susceptible to RF signals ornoises.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A radio frequency (RF) module, comprising: apackaging substrate configured to receive a plurality of components; andfirst and second RF devices implemented on the packaging substrate; aplurality of wirebond structures implemented on the packaging substratebetween the first RF device and the second RF device; a first conductiveground layer in electrical contact with the plurality of wirebondstructures; a first conductive top layer disposed at least partiallyabove the first RF device; and a second conductive top layer inelectrical contact with the plurality of wirebond structures, the secondconductive top layer being at least partially electrically isolated fromthe first conductive top layer, the first conductive ground layer, theplurality of wirebond structures, and the second conductive top layerforming an RF barrier between the first RF device and the second RFdevice.
 2. The RF module of claim 1 wherein the first and secondconductive top layers lie in a first plane that is parallel to a secondplane in which the first conductive ground layer lies
 3. The RF moduleof claim 2 wherein the first plane is substantially parallel to asurface of the packaging substrate.
 4. The RF module of claim 2 whereinthe first and second conductive top layers are separated by at least onephysical gap that spans a first portion of the first plane, the gapproviding at least partial electrical isolation between the first andsecond conductive top layers.
 5. The RF module of claim 2 furthercomprising a third conductive top layer lying in the first plane andbeing at least partially electrically isolated from both the first andsecond conductive top layers.
 6. The RF module of claim 5 wherein thethird conductive top layer is disposed at least partially above thesecond RF device.
 7. The RF module of claim 5 wherein the thirdconductive top layer is disposed at least partially above a third RFdevice implemented on the packaging substrate.
 8. The RF module of claim7 wherein the first RF device includes a first switching device, thesecond RF device includes a second switching device, and the third RFdevice includes an amplifier device.
 9. The RF module of claim 1 furthercomprising a second conductive ground layer disposed at least partiallybelow the first RF device, the second conductive ground layer being atleast partially electrically isolated from the first conductive groundlayer.
 10. The RF module of claim 1 wherein the first conductive groundlayer is substantially the same shape as, and disposed above, the secondconductive top layer.
 11. The RF module of claim 1 wherein a firstportion of the plurality of wirebond structures forms a first rowbetween the first and second RF devices.
 12. The RF module of claim 11wherein a second portion of the plurality of wirebond structures forms asecond row, substantially parallel to the first row.
 13. A radiofrequency (RF) device comprising: a transceiver; first and secondantennas; and a power amplifier module in communication with thetransceiver, the power amplifier module including a first switchingdevice electrically coupled to the first antenna, a second switchingdevice electrically coupled to the second antenna, a plurality ofwirebond structures disposed between the first and second switchingdevices, a first conductive top layer disposed at least partially abovethe first switching device, a second conductive top layer in electricalcontact with the plurality of wirebond structures, the second conductivetop layer being at least partially electrically isolated from the firstconductive ground layer, the power amplifier module further including afirst conductive ground layer in electrical contact with the pluralityof wirebond structures to at least partially form, together with theplurality of wirebond structures and the second conductive top layer, anRF barrier between the first and second switching devices.
 14. The RFdevice of claim 13 wherein the power amplifier module further includesan amplifier device electrically connected to the first and secondswitching devices.
 15. The RF device of claim 14 further comprising athird conductive top layer disposed at least partially above theamplifier device, the third conductive top layer being at leastpartially electrically isolated from the first and second conductive toplayers.
 16. A conductive shielding layer comprising: a first conductivetop layer lying in a first plane and disposed at least partially above afirst radio frequency (RF) device; and a second conductive top layerlying in the first plane that is at least partially electricallyisolated from the first conductive top layer, the second conductive toplayer being electrically connected to a first conductive ground layervia a plurality of wirebond structures disposed between the first RFdevice and a second RF device to at least partially form an RF barrierbetween the first RF device and the second RF device.
 17. The shieldinglayer of claim 16 wherein the first plane is substantially parallel to asecond plane in which the first conductive ground layer lies.
 18. Theshielding layer of claim 16 further comprising a third conductive toplayer, the third conductive top layer lying in the first plane and beingat least partially electrically isolated from both the first and secondconductive top layers.
 19. The shielding layer of claim 18 wherein thethird conductive top layer is disposed at least partially above a thirdRF device.
 20. The shielding layer of claim 16 wherein the first andsecond conductive top layers are separated by at least one physical gapthat spans a first portion of the first plane, the gap providing atleast partial electrical isolation between the first and secondconductive top layers.